Centerline Technologies, LLC
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Start with the right materials, process with precision, and finished for success.
- HoursCLOSED NOW
- Regular Hours:
Mon - Fri Sat - Sun Closed - Phone:
Main - 978-568-1330
Fax - 978-568-1334
- Address:
- 577 Main Street, Suite 270 Hudson, MA 01749
- Email:
- Links:
- Categories
- Contract Manufacturing, Industrial Ceramic Products, Laser Cutting, Machine Shops, Polishes, Solid Surface Materials
- Services / Products
- Materials Inventory/Management, Laser Machining, CMP, Polishing, Via Planarity Processing, Back Grinding, Laser Scribing, Wafer Dicing, Lapping, Laser Drilling, Edge Grinding, Surface Grinding, Substrate Engineering, Aluminum Nitride (AlN) 170 W/mK, 200 W/mK, 230 W/mK, Beryllium Oxide (BeO) 99.5% purity. 285 W/mK or 325 W/mK, Quartz, Fused Silica (SiO2), Zirconia, Alumina (Al2O3) Ceramic Substrates 90%, 96%, 99.5%, 99.6%, 99.8%, Ferrite, Sapphire, Specialty Metals, Specialty Glass, Silicon Carbide, Silicon Nitride (Si3N4) 90 W/mK, Tungsten Carbide
- Payment Options
- Brands
- CoorsTek, Toshiba, Materion, Dynasil, Rubicon, Gavish, Maruwa, CeramTec
- Amenities
- Centerline's inventory of substrate materials, (Al203, AlN, BeO, SiO2, Si3N4, Sapphire, Glass, etc.), from the industries best manufactures, enables us to offer lead times that meet your demands.
- Accreditation
ISO 9001:2015 Customer Focus, Technical Excellence, and Continual Improvement
ITAR Compliant
- Associations
- iMAPS (International Microelectronics and Packaging Society),SPIE (The international society for optics and photonics),ASM International,ACerS (The American Ceramic Society)
- AKA
Centerline Technologies
General Info
Centerline Technologies provides ultra-precision services for grinding, lapping, polishing, diamond sawing and laser machining of metals, ceramic, sapphire and other materials — for the telecommunication, semiconductor, communication, test & measurement, micro-electronic, defense and security industries.